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Apple iPhone 7S, iPhone 7S Plus, Top-tier Model ‘Ferrari’ 2017 Updates: Leaked Documents Reveals Devices’ Codename; Possible Specs, Design Hinted


Apple Inc. is gearing up its next flagship phones for the iPhone series next year after leaked documents suggest a possible three new models and a rumored high-end curved OLED display variant.

According to a new report from a Weibo user who has a decent track record of reporting accurate Apple news, the company will release the 'S' variants to its iPhone 7 and iPhone 7 Plus in 2017, in celebration of its 10th anniversary.

The said post also revealed image renders and details on the phone's codenames. The tipster claims the iPhone 7s, iPhone 7s Plus, and iPhone 8 have internal model numbers of D20, D21, and D22, based on the leaked supply chain documents.

The said three-model lineup confirms previous reports that Apple intends to launch two upgraded iPhone 7 models, likely branded iPhone 7s and iPhone 7s Plus. However, the smartphones will reportedly feature an almost identical design similar to their predecessors, except for few upgrades on their internals like an A11 processor, more RAM, larger batteries, and improved front and rear cameras.

On another note, the third model that is referred to as the iPhone 8 will serve as a redesigned, top-tier model, internally codenamed "Ferrari," Post has learned.

Following the leaked documents, the "Ferrari" iPhone will be released to mark iPhone's 10th anniversary, which should come with "a substantial internal redesign." The high-end smartphone is expected to feature an all-glass design and a borderless AMOLED display, embedded with a virtual home button. Also, it will carry a built-in wireless charging capabilities.

Apple Insider reported that "Ferrari" is also expected to come with an internal redesign that breaks the logic board into two discrete units connected by a flex cable. The first board, Board nr. 1, will feature the operating system such as the A11 chipset and NAND flash storage, while the second board will pack the cellular components and its communications packages with Wi-Fi.

More to the supply chain document, Apple's SIM card tray will be relocated towards the bottom of the handset to free more space for internal components, as seen on the iPad Pro layouts.

For the anniversary edition iPhone in 2017, Apple will reportedly engineer the dual-camera module into new heights, which it introduced with the iPhone 7 Plus, by bring 3D photographing capabilities.

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