The new generation iPhone was speculated to be smaller and thicker.

Apple has been mainly dominant in the mobile media over the recent years, even with growing competition from Microsoft and Google, Apple is still maintaining its composure. A new report claims of having information and details in regards to size and specifications of the much awaited iPhone outing.

The new reports claimed that Apple's upcoming iPhone model could be smaller, but thicker than their present smartphone design, the iPhone 6 series. Another report reveals details on the dimensions of the upcoming Apple iPhone 7, which shows the schematics for the new smartphone. The next generation iPhone may be designed with the dimensions of at least 7.1 mm thickness, which is a little chunkier than their present model, which is only 6.9 mm in thickness, The Next Web reported.

Another detail on the schematics is that the iPhone 7 may be held with a narrower and smaller casing, but it will not affect the display size in any way, even with the change in dimensions. There are other changes in the iPhone's design that can be noticed in the so-called schematics for the iPhone 7, like the 3.5 mm standard headphone jack being removed, and the positioning of the camera module to be much closer to the edge of the smartphone, as some examples.

The tech giant had recently procured from the Hong Kong Patent and Trademark Office, 12 patents. The company was given a patent for the 3D touch that is featured on the current iPhone 6 models. While the other new patents will deal with functionalities and features that will be utilized for the iPad Pro tablet.

These patents were applied for way back in December of 2015, a few months even before the iPad Pro and iPhone 6s device was released to the market. All these patents looks promising since it would seem that all this will be expected to be included in the upcoming iPhone 7.

As for the release date of the iPhone 7, it is speculated to be announced in September 2016, based from the estimate of MacWorld.