Meizu X smartphone is set to unveil on Nov. 30 at a special event in China. This was revealed alongside the announcement that a new Helio chipset will premiere under the slogan "Make Helio Great Again."

The new Meizu X is reported to come with an all-metal design and will be powered by the new Helio X30 chip, made by the premium 10nm process. This feature in Meizu X is expected to bring a new deca-core tri-cluster processor with a 4x Cortex-A73 at 2.8GHz, 2x Cortex-A53 at 2.0GHz and 4x Cortex-A53 at 2.2GHz. Also, the GPU in charge of the graphics in Meizu X is believed to be the PowerVR 7XT quad-core GPU, which is likewise used in the iPhone 7 series.

Meizu X's newly leaked photos also reveal the antenna-less metal back of the smartphone. Although there have been no actual image yet of the screen size, camera resolution and display, the ring flash around Meizu X's camera can bee seen on the leaked photo. Given that, it seems that Meizu was able to hide the antennas better compared to that of the MX6 and the Pro 6, by likely pushing around the top and bottom.

Meantime, Meizu is also rumored to unveil a new Meizu m5 in an upcoming event. The said smartphone is believed to come with a 5.5-inch 1080 display and will likely run on a Helio P20 chip with an octa-core Cortex-A53 processor, 3GB of RAM and Mali-T880 MP2 GPU, GSMArena reported.

Meanwhile, some reports suggest that the back side of Meizu X appears to be the same with all the other phones Meizu had recently introduced. However, some experts believe that the quality of the leaked photos is not accurately all that high.

Meizu X seems to be made out of metal, based on the leaked image, despite previous reports that the company had experimented with polycarbonate recently in Meizu M5. Meizu X is also likely to ship with Flyme 6 out of the box, given that the phone manufacturer hinted the coming of Flyme 6 earlier, Android Headlines reported. Watch Meizu X