The Chinese company Xiaomi will be boasting its Xiaomi Mi 6 flagship this year. It is projected that it will have its grand reveal in the Mobile World Congress from Feb. 27 to March 2. Tech writers and fans are anticipating for its appearance to see whether it is as good as the leaked specs and features floating online.

Xiaomi Mi 6 leaks indicate that the device could be unveiled in three variants, Gadgets 360 reported. Two variants will sport Qualcomm's latest processor Snapdragon 835 chipset while the cheapest variant will be MediaTek Helio X30 powered. Reports claimed that the company will start shipping the phone in April.

According to reports the three variants will be called Xiaomi Mi 6 Youth, as the budget option; Xiaomi Mi 6 Premier, the mid-range option with OLED display with a Quad-HD resolution, and Xiaomi Mi 6 Premier for high-budget option with an all ceramic body, Phandroid reported. The source added that these names have not been finalized yet.

Tech writers believe that this is the surprise product that Xiaomi VP Li Wanquiang has mentioned during the Geek Park Innovation conference in Beijing. It is worth noting that Xiaomi has made its first time appearance at CES just this month and many speculate that they will again be seen at MWC next month bringing Xiaomi Mi 6 series.

The device is expected to have a 4GB of RAM with 128GB of built-in storage option, while the Mi 6 Premier is said to come in 6GB of RAM with 256GB of storage. Sources added that all these devices have dual-rear camera setup.

It is rumored that the device will sport the latest 7.1 Nougat with MIUI 9 skin running on top. The handset is also tipped to pack a large 4000mAh battery with Quick Charge 4.0 support. It joins with other devices in the market today with a fingerprint reader in its Home Button.